Synchronous SRAM chip, 144M-bit density, 8M x 18 configuration, featuring dual 1.8V/2.5V operating supply voltages. Offers maximum clock rate of 167 MHz with access times of 8ns (Flow-Through) and 3.4ns (Pipelined). This surface-mount component utilizes a 119-pin Fine Pitch Ball Grid Array (FBGA) package with a 1.27mm pin pitch. Operates across a temperature range of -40°C to 85°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 119 |
| PCB | 119 |
| Package Length (mm) | 22 |
| Package Width (mm) | 14 |
| Package Height (mm) | 1.26 |
| Seated Plane Height (mm) | 1.86 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 144Mbit |
| Address Bus Width | 23bit |
| Maximum Access Time | 8@Flow-Through|3.4@Pipelinedns |
| Timing Type | Synchronous |
| Maximum Clock Rate | 167MHz |
| Data Rate Architecture | SDR |
| Density in Bits | 150994944bit |
| Maximum Operating Current | 350@Flow-Through|400@PipelinedmA |
| Typical Operating Supply Voltage | 1.8|2.5V |
| Number of Bits per Word | 18bit |
| Number of Ports | 2 |
| Number of Words | 8M |
| Min Operating Supply Voltage | 1.7|2.3V |
| Max Operating Supply Voltage | 2|2.7V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Architecture | Flow-Through|Pipelined |
| Cage Code | 3BKC7 |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.b |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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