Synchronous SRAM chip with 144M-bit density, organized as 8M x 18 bits, featuring dual 1.8V/2.5V operating supply voltages and a maximum clock rate of 200 MHz. This surface-mount component utilizes a Fine Pitch Ball Grid Array (FBGA) package with 119 pins and a 1.27mm pin pitch. It offers maximum access times of 7.5ns (Flow-Through) and 3ns (Pipelined), with an 18-bit data bus and 23-bit address bus. Operating across a temperature range of -40°C to 85°C, this memory IC supports both Flow-Through and Pipelined architectures.
PackageFBGA
MountingSurface Mount
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Technical Specifications
GSI GS8128418GB-200IV technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
119
PCB
119
Package Length (mm)
22
Package Width (mm)
14
Package Height (mm)
1.26
Seated Plane Height (mm)
1.86
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Density
144Mbit
Address Bus Width
23bit
Maximum Access Time
7.5@Flow-Through|3@Pipelinedns
Timing Type
Synchronous
Maximum Clock Rate
200MHz
Data Rate Architecture
SDR
Density in Bits
150994944bit
Maximum Operating Current
360@Flow-Through|435@PipelinedmA
Typical Operating Supply Voltage
1.8|2.5V
Number of Bits per Word
18bit
Number of Ports
2
Number of Words
8M
Min Operating Supply Voltage
1.7|2.3V
Max Operating Supply Voltage
2|2.7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Architecture
Flow-Through|Pipelined
Compliance
Cage Code
3BKC7
EU RoHS
Yes
HTS Code
8542320041
Schedule B
8542320040
ECCN
3A991.b.2.b
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
GSI GS8128418GB-200IV Datasheet
Download the complete datasheet for GSI GS8128418GB-200IV to view detailed technical specifications.
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