Synchronous SRAM chip offering 144M-bit density with a 4M x 36 configuration. Features a 22-bit address bus and 4 ports, supporting both Flow-Through and Pipelined architectures. Operates with a maximum clock rate of 200 MHz and provides maximum access times of 7.5ns (Flow-Through) or 3ns (Pipelined). This surface-mount component utilizes a 119-pin Fine Pitch Ball Grid Array (FBGA) package with a 1.27mm pin pitch, designed for 1.8V or 2.5V supply voltages and operates within a -40°C to 85°C temperature range.
PackageFBGA
MountingSurface Mount
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Technical Specifications
GSI GS8128436B-200IV technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
119
PCB
119
Package Length (mm)
22
Package Width (mm)
14
Package Height (mm)
1.26
Seated Plane Height (mm)
1.86
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Density
144Mbit
Address Bus Width
22bit
Maximum Access Time
7.5@Flow-Through|3@Pipelinedns
Timing Type
Synchronous
Maximum Clock Rate
200MHz
Data Rate Architecture
SDR
Density in Bits
150994944bit
Maximum Operating Current
385@Flow-Through|475@PipelinedmA
Typical Operating Supply Voltage
1.8|2.5V
Number of Bits per Word
36bit
Number of Ports
4
Number of Words
4M
Min Operating Supply Voltage
1.7|2.3V
Max Operating Supply Voltage
2|2.7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Architecture
Flow-Through|Pipelined
Compliance
Cage Code
3BKC7
EU RoHS
No
HTS Code
8542320041
Schedule B
8542320040
ECCN
3A991.b.2.b
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
GSI GS8128436B-200IV Datasheet
Download the complete datasheet for GSI GS8128436B-200IV to view detailed technical specifications.
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