QDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
GSI GS81302DT10E-300I technical specifications.
| Address Bus Width | 22b |
| Package/Case | FBGA |
| Density | 144Mb |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Number of Ports | 2 |
| Operating Supply Voltage | 1.8V |
| RoHS Compliant | No |
| RoHS | Not Compliant |
No datasheet is available for this part.
