The GS8182D37BGD-333I is an 18Mb SRAM with a 17-bit address bus width and two ports. It is packaged in a flip-chip ball grid array (FBGA) and is available in a tray packaging format. The device operates within a temperature range of -40°C to 85°C and is compliant with RoHS regulations. The GS8182D37BGD-333I is not radiation hardened.
PackageFBGA
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Technical Specifications
GSI GS8182D37BGD-333I technical specifications.
General
| Address Bus Width | 17b |
| Package/Case | FBGA |
| Density | 18Mb |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Ports | 2 |
| Operating Supply Voltage | 1.8V |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
GSI GS8182D37BGD-333I Datasheet
Download the complete datasheet for GSI GS8182D37BGD-333I to view detailed technical specifications.
No datasheet is available for this part.