
This enhancement-mode GaN HEMT is rated for 650 V drain-source voltage and 14 A continuous drain current at 25°C case temperature. It provides 110 mΩ typical and 140 mΩ maximum on-state resistance, 2.4 nC typical gate charge, and 0 nC reverse-recovery charge for fast-switching power conversion. The device is housed in a bottom-cooled PG-LSON-8 surface-mount package and supports operation from -55°C to 150°C junction temperature. It is qualified for industrial applications, is RoHS compliant and halogen free, and is planned to be available until at least 2035.
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| Technology | GaN HEMT |
| Drain-Source Voltage | 650V |
| Drain-Source Transient Voltage | 900V |
| Continuous Drain Current | 14A |
| Pulsed Drain Current | 30A |
| On-State Resistance Typ | 110mΩ |
| On-State Resistance Max | 140mΩ |
| Gate Charge Typ | 2.4nC |
| Output Charge Typ | 18nC |
| Power Dissipation | 51W |
| Operating Junction Temperature Min | -55°C |
| Operating Junction Temperature Max | 150°C |
| Thermal Resistance Junction-Case | 2.5°C/W |
| Input Capacitance Typ | 170pF |
| Output Capacitance Typ | 29pF |
| Reverse Recovery Charge | 0nC |
| dv/dt Max | 200V/ns |
| Qualification | Industrial |
| RoHS | Compliant |
| Halogen Free | Yes |
