The PLB2224-E-V13 is a 272-pin Ball Grid Array (BGA) surface mount IC from Intel. It features a plastic package with a seated plane height of 2.35mm maximum and a pin pitch of 1.27mm. The IC is designed for surface mount applications and does not support JTAG. It measures 27mm in length and 27mm in width, with a height of 1.17mm.
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Intel PLB2224-E-V13 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 272 |
| PCB | 272 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.17 |
| Seated Plane Height (mm) | 2.35(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| JTAG Support | No |
| Cage Code | 4BA62 |
| HTS Code | 8517620020 |
| Schedule B | 8517620050 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Intel PLB2224-E-V13 to view detailed technical specifications.
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