The PLB2224EV13NP is a 272-pin Ball Grid Array package from Intel, designed for surface mount applications. It features a plastic ball grid array package with a seated plane height of 2.35mm maximum. The package measures 27mm in length and width, with a height of 1.17mm. This component is suitable for use in computing and embedded systems, particularly in networking applications such as hubs and switches.
Sign in to ask questions about the Intel PLB2224EV13NP datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Intel PLB2224EV13NP technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 272 |
| PCB | 272 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.17 |
| Seated Plane Height (mm) | 2.35(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| JTAG Support | No |
| Cage Code | 4BA62 |
| HTS Code | 8517620020 |
| Schedule B | 8517620050 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Intel PLB2224EV13NP to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
