
The QG5000P SL9TP is a 1432-pin Flip Chip Ball Grid Array (FCBGA) memory controller hub from Intel. It features a plastic package with a surface mount configuration. The device is designed for use in computing and embedded systems applications, and is categorized as a miscellaneous peripheral. The FCBGA package measures 42.5mm in length and width, and has a ball-shaped lead configuration.
Sign in to ask questions about the Intel QG5000P SL9TP datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Intel QG5000P SL9TP technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1432 |
| PCB | 1432 |
| Package Length (mm) | 42.5 |
| Package Width (mm) | 42.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Memory Controller Hub |
| Cage Code | 4BA62 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| ECCN | 4A994 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Download the complete datasheet for Intel QG5000P SL9TP to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.