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Technical Specifications
Intel QG5000P SL9TP technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
1432
PCB
1432
Package Length (mm)
42.5
Package Width (mm)
42.5
Package Material
Plastic
Mounting
Surface Mount
Category
Memory Controller Hub
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542310001
ECCN
4A994
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel QG5000P SL9TP Datasheet
Download the complete datasheet for Intel QG5000P SL9TP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.