
P-channel, 2-element silicon Metal-oxide Semiconductor FET with a continuous drain current of 2.2A and a drain-to-source breakdown voltage of -20V. Features a low Rds On of 135mR, turn-on delay time of 8.3ns, and fall time of 28ns. This surface mount device is housed in a compact TSOP package with dimensions of 3mm (length) x 1.75mm (width) x 1.15mm (height). Operates across a wide temperature range from -55°C to 150°C with a maximum power dissipation of 960mW.
International Rectifier IRF5850TRPBF technical specifications.
| Package/Case | TSOP |
| Continuous Drain Current (ID) | 2.2A |
| Drain to Source Breakdown Voltage | -20V |
| Drain to Source Voltage (Vdss) | 20V |
| Fall Time | 28ns |
| Gate to Source Voltage (Vgs) | 12V |
| Height | 1.15mm |
| Input Capacitance | 320pF |
| Length | 3mm |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 960mW |
| Mount | Surface Mount |
| Number of Elements | 2 |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Polarity | P-CHANNEL |
| Power Dissipation | 960mW |
| Radiation Hardening | No |
| Rds On Max | 135mR |
| RoHS Compliant | Yes |
| Series | HEXFET® |
| Turn-Off Delay Time | 31ns |
| Turn-On Delay Time | 8.3ns |
| Width | 1.75mm |
| RoHS | Compliant |
Download the complete datasheet for International Rectifier IRF5850TRPBF to view detailed technical specifications.
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