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Technical Specifications
Ixys ZGP323HEP2032C technical specifications.
General
Access Time
8us
Package/Case
DIP
Core Architecture
Z8
Data Bus Width
8b
Lead Free
Contains Lead
Max Frequency
8MHz
Max Operating Temperature
105°C
Min Operating Temperature
-40°C
Max Supply Voltage
5.5V
Memory Size
32KB
Memory Type
OTP,
Min Supply Voltage
2V
Number of I/Os
16
Number of Programmable I/O
16
Oscillator Type
Internal
Package Quantity
18
Packaging
Rail/Tube
Peripherals
POR, WDT, HLVD
RAM Size
237B
RoHS Compliant
No
Series
Z8® GP™
Compliance
RoHS
Not Compliant
Datasheet
Ixys ZGP323HEP2032C Datasheet
Download the complete datasheet for Ixys ZGP323HEP2032C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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