Search Results for &quot; BCM20732E &quot;

32-bit ARM Core, 512Kb EEPROM, 9-Channel ADC, LGA Package

Volume Production

Package/Case: LGA

Core Architecture: ARM

Data Bus Width: 32b

Height: 1.2mm

BCM20732ST

32-bit ARM Core, 512Kb EEPROM, 9-Channel ADC, SPI/UART, LGA Package

Volume Production

Package/Case: LGA

Core Architecture: ARM

Data Bus Width: 32b

Height: 1.2mm

Bluetooth 1.2V 32-Pin QFN

Volume Production

Package/Case: SIP

Core Architecture: ARM

Data Bus Width: 32b

Interface: SPI, UART

BCM20736E

48-Pin Industrial Temperature BGA IC

TFLGA,

Obsolete

Max Operating Temperature: 85

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: BOTTOM

Telecom Circuit,

Obsolete

Search Results for "BCM20732E"

Filters

BCM20732S

32-bit ARM Core, 512Kb EEPROM, 9-Channel ADC, LGA Package

Volume Production

Package/Case: LGA

Core Architecture: ARM

Data Bus Width: 32b

Height: 1.2mm

BCM20732ST

32-bit ARM Core, 512Kb EEPROM, 9-Channel ADC, SPI/UART, LGA Package

Volume Production

Package/Case: LGA

Core Architecture: ARM

Data Bus Width: 32b

Height: 1.2mm

Bluetooth 1.2V 32-Pin QFN

Volume Production

Package/Case: SIP

Core Architecture: ARM

Data Bus Width: 32b

Interface: SPI, UART

BCM20736E

48-Pin Industrial Temperature BGA IC

TFLGA,

Obsolete

Max Operating Temperature: 85

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: BOTTOM

Telecom Circuit,