A17752-20

Tflex HD90000 is a high-performance silicone-based thermal gap filler that combines a high thermal conductivity of 7.5 W/mK with superior pressure versus deflection characteristics. This combination allows for minimal stress on components while yielding low thermal resistance. The material is ceramic-filled, provides excellent surface wetting for low contact resistance, and is characterized by low outgassing and low D3-D20 levels. It is designed to bridge air gaps and irregularities in electronic assemblies to enhance cooling efficiency.