Tflex HD90000 is a high-performance silicone-based thermal gap filler that combines a high thermal conductivity of 7.5 W/mK with superior pressure versus deflection characteristics. This combination allows for minimal stress on components while yielding low thermal resistance. The material is ceramic-filled, provides excellent surface wetting for low contact resistance, and is characterized by low outgassing and low D3-D20 levels. It is designed to bridge air gaps and irregularities in electronic assemblies to enhance cooling efficiency.
Laird A17752-20 technical specifications.
| Thermal Conductivity | 7.5W/m-K |
| Thickness | 5.00mm |
| Operating Temperature Range | -65 to 125°C |
| Hardness | 32Shore 00 |
| Dimensions | 228.6 x 228.6mm |
| Color | Gray |
| Dielectric Constant | 8.14@ 1 MHz |
| Volume Resistivity | 8.73 x 10^13Ohm-cm |
| Flammability Rating | UL 94 V-0 |
| Density | 3.5g/cc |
| RoHS | Compliant |
| REACH | Compliant |
| Lead Free | Yes |
No datasheet is available for this part.
