PackageTQFP
MountingSurface Mount
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Technical Specifications
Lapis Semiconductor ML7037-003 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Category
Echo Canceler and Noise Canceler
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Lapis Semiconductor ML7037-003 Datasheet
Download the complete datasheet for Lapis Semiconductor ML7037-003 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.