PackageTQFP
MountingSurface Mount
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Technical Specifications
Lapis Semiconductor ML7037-003 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | TQFP |
| Package Description | Thin Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 10 |
| Package Width (mm) | 10 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Echo Canceler and Noise Canceler |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Lapis Semiconductor ML7037-003 Datasheet
Download the complete datasheet for Lapis Semiconductor ML7037-003 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.