Asynchronous dual uni-directional FIFO memory with 4M bit density, organized as 256K x 8 x 2. Features an 8-bit data bus width and a maximum access time of 25 ns. Operates with a typical supply voltage of 5V, ranging from 4.5V to 5.5V, and a maximum operating current of 120 mA. Housed in a 100-pin TQFP (Thin Quad Flat Package) with gull-wing leads, suitable for surface mounting. Operating temperature range is 0°C to 70°C.
PackageTQFP
MountingSurface Mount
Quick Jump:
Technical Specifications
Lapis Semiconductor MS8104160-30TB technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | TQFP |
| Package Description | Thin Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 100 |
| PCB | 100 |
| Package Length (mm) | 14 |
| Package Width (mm) | 14 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026AED |
| Density | 4Mbit |
| Timing Type | Asynchronous |
| Configuration | Dual |
| Bus Directional | Uni-Directional |
| Maximum Operating Current | 120mA |
| Maximum Access Time | 25ns |
| Typical Operating Supply Voltage | 5V |
| Organization | 256Kx8x2 |
| Data Bus Width | 8bit |
| Expansion Support | No |
| Density in Bits | 4194304bit |
| Min Operating Supply Voltage | 4.5V |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Lapis Semiconductor MS8104160-30TB Datasheet
Download the complete datasheet for Lapis Semiconductor MS8104160-30TB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.