Lapis Semiconductor
MS8104166-20TB
FIFO IC: 4Mbit, 256Kx8x2, Async, Dual Uni-Dir, 18ns, 5V, 100-Pin TQFP
Asynchronous Dual Uni-Directional FIFO Memory IC, 4M bit density, 256K x 8 x 2 organization, 8-bit data bus width. Features 18 ns maximum access time and 170 mA maximum operating current. Operates from a 4.5 V to 5.5 V supply voltage with a typical of 5 V. Packaged in a 100-pin TQFP (Thin Quad Flat Package) with gull-wing leads for surface mounting. Operating temperature range from 0 °C to 70 °C.
PackageTQFP
MountingSurface Mount
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Technical Specifications
Lapis Semiconductor MS8104166-20TB technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
100
PCB
100
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026AED
Density
4Mbit
Timing Type
Asynchronous
Configuration
Dual
Bus Directional
Uni-Directional
Maximum Operating Current
170mA
Maximum Access Time
18ns
Typical Operating Supply Voltage
5V
Organization
256Kx8x2
Data Bus Width
8bit
Expansion Support
No
Density in Bits
4194304bit
Min Operating Supply Voltage
4.5V
Max Operating Supply Voltage
5.5V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Lapis Semiconductor MS8104166-20TB Datasheet
Download the complete datasheet for Lapis Semiconductor MS8104166-20TB to view detailed technical specifications.
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