Field Programmable Gate Array (FPGA) with 200,000 system gates and 3520 logic cells, built on 65nm process technology. Features 80 Kbit RAM and 20 block RAMs, supporting up to 150 user I/Os. Packaged in a 132-pin Chip Scale Ball Grid Array (CSBGA) with a 0.5mm pin pitch, measuring 8x8x0.85mm. Designed for surface mount applications with an operating temperature range of -40°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor iCE65L04F-LCB132I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
132
PCB
132
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
iCE65
Maximum Number of User I/Os
150
RAM Bits
80Kbit
Device Logic Cells
3520
Process Technology
65nm
Device System Gates
200000
Programmability
Yes
Program Memory Type
Flash
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Total Number of Block RAM
20
Compliance
Cage Code
66675
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lattice Semiconductor iCE65L04F-LCB132I Datasheet
Download the complete datasheet for Lattice Semiconductor iCE65L04F-LCB132I to view detailed technical specifications.
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