Field Programmable Gate Array (FPGA) featuring 200,000 system gates and 3,520 logic cells, built on 65nm process technology. This device offers 80 Kbit of RAM, 20 Block RAMs, and up to 150 user I/Os. It is housed in a 132-pin Chip Scale Ball Grid Array (CSBGA) package with a 0.5mm pin pitch, measuring 8mm x 8mm x 0.85mm. Designed for surface mounting, it operates within a temperature range of 0°C to 70°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor iCE65L04F-UCB132C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 132 |
| PCB | 132 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | iCE65 |
| Maximum Number of User I/Os | 150 |
| RAM Bits | 80Kbit |
| Device Logic Cells | 3520 |
| Process Technology | 65nm |
| Device System Gates | 200000 |
| Programmability | Yes |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Total Number of Block RAM | 20 |
Compliance
| Cage Code | 66675 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Lattice Semiconductor iCE65L04F-UCB132C Datasheet
Download the complete datasheet for Lattice Semiconductor iCE65L04F-UCB132C to view detailed technical specifications.
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