Field Programmable Gate Array (FPGA) featuring 200,000 system gates and 3,520 logic cells, built on 65nm process technology. This device offers 80 Kbit of RAM and 20 Block RAMs, with a maximum of 150 user I/Os. Packaged in a 132-pin Chip Scale Ball Grid Array (CSBGA) measuring 8x8x0.85mm with a 0.5mm pin pitch, it supports surface mount installation and operates within a temperature range of -40°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor iCE65L04F-UCB132I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
132
PCB
132
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
iCE65
Maximum Number of User I/Os
150
RAM Bits
80Kbit
Device Logic Cells
3520
Process Technology
65nm
Device System Gates
200000
Programmability
Yes
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Total Number of Block RAM
20
Compliance
Cage Code
66675
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lattice Semiconductor iCE65L04F-UCB132I Datasheet
Download the complete datasheet for Lattice Semiconductor iCE65L04F-UCB132I to view detailed technical specifications.
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