Field Programmable Gate Array (FPGA) featuring 200,000 system gates and 3,520 logic cells, built on 65nm process technology. This device offers 80 Kbit of RAM and 20 Block RAMs, with a maximum of 150 user I/Os. Packaged in a 132-pin Chip Scale Ball Grid Array (CSBGA) measuring 8x8x0.85mm with a 0.5mm pin pitch, it supports surface mount installation and operates within a temperature range of -40°C to 85°C.
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Lattice Semiconductor iCE65L04F-UCB132I technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 132 |
| PCB | 132 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | iCE65 |
| Maximum Number of User I/Os | 150 |
| RAM Bits | 80Kbit |
| Device Logic Cells | 3520 |
| Process Technology | 65nm |
| Device System Gates | 200000 |
| Programmability | Yes |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Total Number of Block RAM | 20 |
| Cage Code | 66675 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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