Field-Programmable Gate Array (FPGA) with 7680 logic cells and 400,000 system gates, built on 65nm process technology. Features 128 Kbit RAM and 32 Block RAMs, supporting up to 150 user I/Os. Packaged in a 132-pin Chip Scale Ball Grid Array (CSBGA) with a 0.5mm pin pitch, measuring 8x8x0.85mm. Designed for surface mounting with a -40°C to 85°C operating temperature range.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Lattice Semiconductor iCE65L08F-LCB132I datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Lattice Semiconductor iCE65L08F-LCB132I technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 132 |
| PCB | 132 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | iCE65 |
| Maximum Number of User I/Os | 150 |
| RAM Bits | 128Kbit |
| Device Logic Cells | 7680 |
| Process Technology | 65nm |
| Device System Gates | 400000 |
| Programmability | Yes |
| Program Memory Type | Flash |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Total Number of Block RAM | 32 |
| Cage Code | 66675 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Lattice Semiconductor iCE65L08F-LCB132I to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
