Field Programmable Gate Array (FPGA) with 400,000 system gates and 7680 logic cells, built on 65nm process technology. Features 128 Kbit RAM and 32 Block RAMs, supporting up to 150 user I/Os. Packaged in a 132-pin Chip Scale Ball Grid Array (CSBGA) measuring 8x8x0.85mm with a 0.5mm pin pitch for surface mounting. Operates across a temperature range of -40°C to 85°C.
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Lattice Semiconductor iCE65L08F-UCB132I technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 132 |
| PCB | 132 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | iCE65 |
| Maximum Number of User I/Os | 150 |
| RAM Bits | 128Kbit |
| Device Logic Cells | 7680 |
| Process Technology | 65nm |
| Device System Gates | 400000 |
| Programmability | Yes |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Total Number of Block RAM | 32 |
| Cage Code | 66675 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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