Field Programmable Gate Array (FPGA) with 99,400 system gates and 3,600 logic cells. Features 3,600 registers, 56.3 Kbit RAM, and 286 maximum user I/Os. Operates at 277.78MHz with 0.3um process technology and a 3.3V supply. Packaged in a 352-pin BGA (35mm x 35mm x 1.73mm) for surface mounting, with a pin pitch of 1.27mm. Supports a temperature range of -40°C to 85°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 352 |
| PCB | 352 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.33 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | ORCA Series 2 |
| Maximum Number of User I/Os | 286 |
| Number of Registers | 3600 |
| RAM Bits | 56.3Kbit |
| Device Logic Cells | 3600 |
| Number of Look-up Table Input | 4 |
| Process Technology | 0.3um |
| Device System Gates | 99400 |
| Programmability | Yes |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Speed Grade | 5 |
| Cage Code | 66675 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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