1M-bit asynchronous SRAM chip featuring a 128K x 8 configuration. This surface-mount component offers a maximum access time of 70 ns and operates from a 5V supply voltage (4.5V to 5.5V). Housed in a 36-pin TFBGA package with a 0.75mm pitch, it measures 8mm x 6mm x 0.94mm. Ideal for applications requiring fast, non-volatile data storage within a compact footprint.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 36 |
| PCB | 36 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.94(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 1Mbit |
| Address Bus Width | 17bit |
| Maximum Access Time | 70ns |
| Timing Type | Asynchronous |
| Density in Bits | 1048576bit |
| Maximum Operating Current | 50mA |
| Typical Operating Supply Voltage | 5V |
| Number of Bits per Word | 8bit |
| Number of Ports | 1 |
| Number of Words | 128K |
| Min Operating Supply Voltage | 4.5V |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | EAR99 |
| RoHS Versions | 2011/65/EU, 2015/863 |
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