Async SRAM chip, 4M-bit density (512K x 8), featuring 70ns maximum access time. This surface-mount component utilizes a 36-pin Thin Fine Pitch Ball Grid Array (TFBGA) package with a 0.75mm pin pitch. Operates from a 4.5V to 5.5V supply, with a typical operating voltage of 5V and a maximum operating current of 50mA. Suitable for applications within a 0°C to 70°C temperature range.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Lyontek LY625128GL-70LL technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
36
PCB
36
Package Length (mm)
8
Package Width (mm)
6
Package Height (mm)
0.94(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.75
Package Material
Plastic
Mounting
Surface Mount
Density
4Mbit
Address Bus Width
19bit
Maximum Access Time
70ns
Timing Type
Asynchronous
Density in Bits
4194304bit
Maximum Operating Current
50mA
Typical Operating Supply Voltage
5V
Number of Bits per Word
8bit
Number of Ports
1
Number of Words
512K
Min Operating Supply Voltage
4.5V
Max Operating Supply Voltage
5.5V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
EU RoHS
Yes
HTS Code
8542320041
Schedule B
8542320040
ECCN
3A991.b.2.a
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lyontek LY625128GL-70LL Datasheet
Download the complete datasheet for Lyontek LY625128GL-70LL to view detailed technical specifications.
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