4M-bit asynchronous SRAM chip, organized as 512K words by 8 bits, features a 55ns maximum access time. This surface-mount component operates from a 2.7V to 5.5V supply, with a typical 3V requirement, and consumes a maximum of 60mA. The 36-pin Thin Fine Pitch Ball Grid Array (TFBGA) package measures 8mm x 6mm with a 0.75mm pin pitch, suitable for high-density board layouts.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 36 |
| PCB | 36 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.94(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 4Mbit |
| Address Bus Width | 19bit |
| Maximum Access Time | 55ns |
| Timing Type | Asynchronous |
| Density in Bits | 4194304bit |
| Maximum Operating Current | 60mA |
| Typical Operating Supply Voltage | 3V |
| Number of Bits per Word | 8bit |
| Number of Ports | 1 |
| Number of Words | 512K |
| Min Operating Supply Voltage | 2.7V |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| RoHS Versions | 2011/65/EU, 2015/863 |
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