16Mbit NVSRAM, organized as 2Mx8, features a parallel interface and 100ns maximum access time. This surface-mount component operates from a 3V to 3.6V supply, with a typical 3.3V. Housed in a 256-pin BGA package measuring 27x27x7.77mm with a 1.27mm pin pitch, it supports a -40°C to 85°C operating temperature range.
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Maxim DS2070W-100TR technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 7.77 |
| Seated Plane Height (mm) | 8.37 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Type | NVSRAM |
| Maximum Access Time | 100ns |
| Density in Bits | 16777216bit |
| Maximum Operating Current | 50mA |
| Organization | 2Mx8 |
| Data Bus Width | 8bit |
| Interface Type | Parallel |
| Typical Operating Supply Voltage | 3.3V |
| Min Operating Supply Voltage | 3V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 1ES66 |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
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