PackageCSBGA
MountingSurface Mount
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Technical Specifications
Maxim DS3665B+ technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
49
PCB
49
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
1.04
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Category
Secure Memory with Tamper Response Hierarchy
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1ES66
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim DS3665B+ Datasheet
Download the complete datasheet for Maxim DS3665B+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.