Single DPDT analog switch, WLP package, 9-pin, surface mount. Features a 1.3mm x 1.3mm x 0.45mm wafer-level package with 0.4mm pin pitch. Offers non-inverting polarity and a DPDT switch architecture with <1 Ohm maximum on resistance. Operates across a -40°C to 85°C temperature range.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | WLP |
| Package/Case | WLP |
| Package Description | Wafer Level Package |
| Lead Shape | Ball |
| Pin Count | 9 |
| PCB | 9 |
| Package Length (mm) | 1.3(Max) |
| Package Width (mm) | 1.3(Max) |
| Package Height (mm) | 0.45 |
| Seated Plane Height (mm) | 0.64 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Analog Switch |
| Configuration | Single DPDT |
| Number of Channels per Chip | 1 |
| Switch Architecture | DPDT |
| Number of Inputs per Chip | 2 |
| Number of Outputs per Chip | 4 |
| Polarity | Non-Inverting |
| Maximum On Resistance Range | <1Ohm |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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