PackageTQFN EP
MountingSurface Mount
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Technical Specifications
Maxim MAX16067ETJ+ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
TQFN EP
Package Description
Thin Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
32
PCB
32
Package Length (mm)
5
Package Width (mm)
5
Package Height (mm)
0.73
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220WHHD-2
Category
Flash Configurable System Manager
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1ES66
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MAX16067ETJ+ Datasheet
Download the complete datasheet for Maxim MAX16067ETJ+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.