PackageTSSOP EP
MountingSurface Mount
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Technical Specifications
Maxim MAX16838AUP+ technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP EP
Package Description
Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
6.6(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AC
Topology
Buck-Boost
Maximum Output Current
150mA
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Max Operating Supply Voltage
5.5V
Maximum Power Dissipation
2051mW
Min Operating Supply Voltage
4.55V
Typical Operating Supply Voltage
5V
Compliance
Cage Code
1ES66
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MAX16838AUP+ Datasheet
Download the complete datasheet for Maxim MAX16838AUP+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.