The MAX16838AUP+ is a 20-pin TSSOP EP Lead-Frame SMT Buck-Boost Power Management IC from Maxim. It operates over a temperature range of -40°C to 125°C and can supply up to 150mA of current. The device is designed for surface mount applications and has a maximum power dissipation of 2051mW. It is suitable for use in a variety of applications, including LED drivers.
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Maxim MAX16838AUP+ technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP EP |
| Package Description | Thin Shrink Small Outline Package, Exposed Pad |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 6.6(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AC |
| Topology | Buck-Boost |
| Maximum Output Current | 150mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| Max Operating Supply Voltage | 5.5V |
| Maximum Power Dissipation | 2051mW |
| Min Operating Supply Voltage | 4.55V |
| Typical Operating Supply Voltage | 5V |
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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