PackageWLP
MountingSurface Mount
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Technical Specifications
Maxim MAX7359EWA+ technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
WLP
Package/Case
WLP
Package Description
Wafer Level Package
Lead Shape
Ball
Pin Count
25
PCB
25
Package Length (mm)
2.16(Max)
Package Width (mm)
2.16(Max)
Package Height (mm)
0.45
Seated Plane Height (mm)
0.64
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Category
Key Switch Controller
Compliance
Cage Code
1ES66
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MAX7359EWA+ Datasheet
Download the complete datasheet for Maxim MAX7359EWA+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.