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| Basic Package Type | Ball Grid Array |
| Package Family Name | WLP |
| Package/Case | WLP |
| Package Description | Wafer Level Package |
| Lead Shape | Ball |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 2.11(Max) |
| Package Width (mm) | 1.74(Max) |
| Package Height (mm) | 0.45 |
| Seated Plane Height (mm) | 0.64 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Dual Phase Adaptive DC-DC Step-Up Converter |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| ECCN | 5A991.g |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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