The MAX8527EUD-TG48 is a Thin Shrink Small Outline Package, Exposed Pad IC with 14 lead Gull-wing shape and 0.65mm Pin Pitch. It has a maximum package length of 5.1mm, width of 4.5mm, and height of 0.95mm. The IC is designed for surface mount and has a seated plane height of 1.1mm. It is made of plastic and meets the MO-153AB-1 Jedec standard.
PackageTSSOP EP
MountingSurface Mount
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Technical Specifications
Maxim MAX8527EUD-TG48 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP EP |
| Package Description | Thin Shrink Small Outline Package, Exposed Pad |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AB-1 |
Compliance
| Cage Code | 1ES66 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Maxim MAX8527EUD-TG48 Datasheet
Download the complete datasheet for Maxim MAX8527EUD-TG48 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.