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Maxim MAX8631XETI+WG19 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | TQFN EP |
| Package Description | Thin Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 4 |
| Package Width (mm) | 4 |
| Package Height (mm) | 0.73 |
| Seated Plane Height (mm) | 0.75 |
| Pin Pitch (mm) | 0.4 |
| Mounting | Surface Mount |
| Jedec | MO-220WGGE |
| Number of Segments | 8 |
| Low Level Output Current | 400000(Typ)uA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 5.5V |
| Maximum Power Dissipation | 1666mW |
| Maximum Supply Current | 4000(Typ)uA |
| Min Operating Supply Voltage | 2.7V |
| Typical Operating Supply Voltage | 3.3|5V |
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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