PackageTQFN EP
MountingSurface Mount
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Technical Specifications
Maxim MAX8631XETI+WG19 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
TQFN EP
Package Description
Thin Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
28
PCB
28
Package Length (mm)
4
Package Width (mm)
4
Package Height (mm)
0.73
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.4
Mounting
Surface Mount
Jedec
MO-220WGGE
Number of Segments
8
Low Level Output Current
400000(Typ)uA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
5.5V
Maximum Power Dissipation
1666mW
Maximum Supply Current
4000(Typ)uA
Min Operating Supply Voltage
2.7V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
1ES66
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MAX8631XETI+WG19 Datasheet
Download the complete datasheet for Maxim MAX8631XETI+WG19 to view detailed technical specifications.
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