The MAX8661ETL+TG104 is a surface mount power management IC packaged in a 40-pin TQFN EP with an exposed pad. It has a non-lead-frame SMT package type and a plastic material. The IC is suitable for surface mount applications and has a seated plane height of 0.75mm. The package dimensions are 5mm in length and width, with a height of 0.73mm. The IC is compliant with the MO-220WHEE-1 Jedec standard.
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Maxim MAX8661ETL+TG104 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | TQFN EP |
| Package Description | Thin Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 5 |
| Package Width (mm) | 5 |
| Package Height (mm) | 0.73 |
| Seated Plane Height (mm) | 0.75 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220WHEE-1 |
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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