General Purpose Audio Codec featuring 2 Analog-to-Digital Converters (ADCs) and 2 Digital-to-Analog Converters (DACs). This wafer-level package (WLP) component offers a 30-pin ball grid array with a 0.4mm pin pitch and surface mount capability. It supports serial interfaces including I2C and I2S, with a sampling rate of 48 ksps. Operating across a supply voltage range of 1.65V to 3.6V, this IC boasts a 90 dB signal-to-noise ratio and -83 dB THD+N.
PackageWLP
MountingSurface Mount
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Technical Specifications
Maxim MAX9867EWV+ technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
WLP
Package/Case
WLP
Package Description
Wafer Level Package
Lead Shape
Ball
Pin Count
30
PCB
30
Package Length (mm)
2.77(Max)
Package Width (mm)
2.36(Max)
Package Height (mm)
0.43
Seated Plane Height (mm)
0.64
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Type
General Purpose
Number of ADCs
2
Number of DACs
2
Sampling Rate
48ksps
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
1.95|3.6V
Interface Type
Serial (I2C, I2S)
Typical Operating Supply Voltage
1.8V
Power Supply Type
Analog|Digital
Min Operating Supply Voltage
1.65V
Number of Channels
2ADC / 2DAC
Number of ADC Inputs
1
Number of DAC Outputs
1
Maximum Power Dissipation
1000mW
Signal to Noise Ratio
90dB
Total Harmonic Distortion Plus Noise (THD+N)
-83dB
Compliance
Cage Code
1ES66
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MAX9867EWV+ Datasheet
Download the complete datasheet for Maxim MAX9867EWV+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.