PackageDIP
MountingThrough Hole
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Technical Specifications
Maxim ZLP32300P2032C technical specifications.
General
Package/Case
DIP
Core Architecture
Z8
Max Operating Temperature
70°C
Memory Size
32KB
Memory Type
OTP,
Min Operating Temperature
0°C
Mount
Through Hole
Number of I/Os
16
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
Brown-out Detect/Reset, POR, WDT, HLVD
RoHS Compliant
No
Series
Crimzon™ ZLP
Compliance
RoHS
Not Compliant
Datasheet
Maxim ZLP32300P2032C Datasheet
Download the complete datasheet for Maxim ZLP32300P2032C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.