Dual-channel UART with 256-byte transmit and receive FIFOs, supporting RS-485 standard. Features a maximum data rate of 31.25Mbps and operates at a typical supply voltage of 3.3V. Housed in a 113-pin LFBGA package with a 0.8mm pin pitch, measuring 9x9x1.05mm. Surface mountable with a maximum supply current of 70mA and operating temperature range of -40°C to 85°C.
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Maxlinear XR17V352IB113-F technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LFBGA |
| Package Description | Low Profile Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 113 |
| PCB | 113 |
| Package Length (mm) | 9 |
| Package Width (mm) | 9 |
| Package Height (mm) | 1.05 |
| Seated Plane Height (mm) | 1.38 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Receive FIFO | 256byte |
| Number of Channels per Chip | 2 |
| Transmit FIFO | 256byte |
| Maximum Data Rate | 31.25Mbps |
| Transmitter and Receiver FIFO Counter | Yes |
| Standard Supported | RS-485 |
| Maximum Supply Current | 70mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Typical Operating Supply Voltage | 3.3V |
| Maximum Power Dissipation | 500mW |
| Cage Code | 6VGW5 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
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