A Field Programmable Gate Array (FPGA) features 1,000,000 system gates and 24,576 logic elements. Flash*Freeze technology enables ultra-low power consumption, making it suitable for portable and power-conscious applications through its single-chip, reprogrammable, and nonvolatile architecture. Integrated memory includes 147,456 total RAM bits and 1,024 Flash ROM bits, complemented by 177 user I/Os and 6 PLLs for flexible connectivity and clock management. Operating within a voltage supply range of 1.14V to 1.575V and a temperature range of 0°C to 70°C (TA), the device is fabricated using a 130-nm, 7-layer metal, Flash-based CMOS process. It comes in a 256-LBGA (17x17 mm) surface mount package, offering efficient integration.
MICROCHIP TECHNOLOGY AGL1000V2-FGG256 technical specifications.
| Logic Elements | 24576LEs |
| System Gates | 1000000Gates |
| Total RAM Bits | 147456bits |
| Flash ROM Bits | 1024bits |
| Number of I/O | 177I/O |
| Voltage Supply | 1.14 to 1.575V |
| Operating Temperature | 0 to 70°C (TA) |
| PLLs | 6 |
| Process Technology | 130-nm, 7-layer metal, Flash-based CMOS |
No datasheet is available for this part.
