PackageCase 1
MountingThrough Hole
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Technical Specifications
Microchip 1N6383E3/TR12 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DO-201
Package/Case
Case 1
Package Description
Axial Lead Package
Lead Shape
Through Hole
Pin Count
2
PCB
2
Package Length (mm)
9.53(Max)
Seated Plane Height (mm)
5.21(Max)
Package Diameter (mm)
5.21(Max)
Package Material
Plastic
Mounting
Through Hole
Direction Type
Bi-Directional
Configuration
Single
Maximum Reverse Stand-Off Voltage
10V
Maximum Reverse Leakage Current
2uA
Maximum Clamping Voltage
14.5V
Maximum Peak Pulse Current
90A
Minimum Breakdown Voltage
11.7V
Peak Pulse Power Dissipation
1500W
Min Operating Temperature
-65°C
Max Operating Temperature
150°C
Number of Elements per Chip
1
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8541100080
Schedule B
8541100080
ECCN
EAR99
Automotive
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip 1N6383E3/TR12 Datasheet
Download the complete datasheet for Microchip 1N6383E3/TR12 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.