Frequency3MHz
PackageDIE
MountingSurface Mount
Quick Jump:
Technical Specifications
Microchip 93LC66C-I/WF15K technical specifications.
General
Access Time-Max
300ns
Package/Case
DIE
Density
4Kb
Frequency
3MHz
Interface
Serial
Max Frequency
2MHz
Max Operating Temperature
85°C
Memory Size
4Kb
Memory Type
Non-Volatile, , EEPROM
Min Operating Temperature
-40°C
Mount
Surface Mount
Packaging
Tray
Radiation Hardening
No
Compliance
RoHS
Not CompliantNo
Datasheet
Microchip 93LC66C-I/WF15K Datasheet
Download the complete datasheet for Microchip 93LC66C-I/WF15K to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.