UV EPROM, 64K-bit density, organized as 8K x 8, offers a maximum access time of 90 ns. This through-hole component features a windowed ceramic dual in-line package (CDIP) with 24 pins. It supports in-system and external reprogramming via UV light and operates with a typical supply voltage of 5V, ranging from 4.5V to 5.5V. The device functions across an industrial temperature range of -40°C to 85°C.
PackageWindowed CDIP
MountingThrough Hole
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Technical Specifications
Microchip AT27HC641-90DI technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
Windowed CDIP
Package Description
Windowed Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
24
PCB
24
Package Length (mm)
32.8(Max)
Package Width (mm)
15.5(Max)
Package Height (mm)
4.2(Max)
Seated Plane Height (mm)
5.72(Max)
Pin Pitch (mm)
2.79(Max)
Package Material
Ceramic
Mounting
Through Hole
Density
64Kbit
Maximum Access Time
90ns
Interface Type
Parallel
Maximum Operating Current
90mA
Organization
8Kx8
Reprogramming Technique
UV
Typical Operating Supply Voltage
5V
In-System Programmability
In System|External
Density in Bits
65536bit
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
4.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8542320061
Schedule B
8542320060
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip AT27HC641-90DI Datasheet
Download the complete datasheet for Microchip AT27HC641-90DI to view detailed technical specifications.
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