The LX6523AID is a 14-pin SOIC packaged power management IC with a lead-frame SMT package type. It has a seated plane height of 1.75mm and a maximum package height of 1.5mm. The IC is designed for surface mount applications and is made of plastic material. It has a gull-wing lead shape and a small outline IC package description.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.74(Max) |
| Package Width (mm) | 3.94(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
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