PackageDFN EP
MountingSurface Mount
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Technical Specifications
Microchip MCP14700-E/MF technical specifications.
General
Package/Case
DFN EP
Package Description
Dual Flat Package No Lead, Exposed Pad
Pin Count
8
PCB
8
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.88
Mounting
Surface Mount
Driver Type
High and Low Side
Driver Configuration
Non-Inverting
Peak Output Current
3.5(Typ)A
Number of Drivers
2
Min Operating Supply Voltage
4.5V
Typical Operating Supply Voltage
5V
Max Operating Supply Voltage
5.5V
Input Logic Compatibility
CMOS|TTL
Maximum Rise Time
10(Typ)ns
Maximum Fall Time
10(Typ)ns
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
High and Low Sides Dependency
Independent
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip MCP14700-E/MF Datasheet
Download the complete datasheet for Microchip MCP14700-E/MF to view detailed technical specifications.
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