The MCP3427T-E/UN is a 10-pin lead-frame SMT package with a micro small outline package description and gull-wing leads. It is designed for surface mount applications with a package height of 0.85mm. The device is compliant with Jedec MO-187BA standards. The MCP3427T-E/UN is a surface mount device with a 3mm x 3mm footprint.
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Microchip MCP3427T-E/UN technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package/Case | MSOP |
| Package Description | Micro Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 10 |
| PCB | 10 |
| Package Length (mm) | 3 |
| Package Width (mm) | 3 |
| Package Height (mm) | 0.85 |
| Mounting | Surface Mount |
| Jedec | MO-187BA |
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Microchip MCP3427T-E/UN to view detailed technical specifications.
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