PackageQFN EP
MountingSurface Mount
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Technical Specifications
Microchip MIC3003GML technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
4
Package Width (mm)
4
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Category
Fiber Optic Module Controller
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip MIC3003GML Datasheet
Download the complete datasheet for Microchip MIC3003GML to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.