PackageSOIC
Capacitance1.5(Typ)pF
MountingSurface Mount
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Technical Specifications
Microchip MMAD1106/TR13 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
8.74(Max)
Package Width (mm)
3.94(Max)
Package Height (mm)
1.5(Max)
Seated Plane Height (mm)
1.75(Max)
Package Material
Plastic
Mounting
Surface Mount
Configuration
Octal
Type
Diode Array
Direction Type
Uni-Directional
Maximum Working Voltage
75V
Maximum Power Dissipation
1500mW
Maximum Leakage Current
0.2uA
Capacitance
1.5(Typ)pF
Number of Elements per Chip
8
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip MMAD1106/TR13 Datasheet
Download the complete datasheet for Microchip MMAD1106/TR13 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.