PackageSOIC
Capacitance1.5(Typ)pF
MountingSurface Mount
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Technical Specifications
Microchip MMAD1106E3/TR13 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.74(Max) |
| Package Width (mm) | 3.94(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Configuration | Octal |
| Type | Diode Array |
| Direction Type | Uni-Directional |
| Maximum Working Voltage | 75V |
| Maximum Power Dissipation | 1500mW |
| Maximum Leakage Current | 0.2uA |
| Capacitance | 1.5(Typ)pF |
| Number of Elements per Chip | 8 |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8536308000 |
| Schedule B | 8536300000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Microchip MMAD1106E3/TR13 Datasheet
Download the complete datasheet for Microchip MMAD1106E3/TR13 to view detailed technical specifications.
No datasheet is available for this part.