Frequency3.58MHz
PackagePDIP
MountingThrough Hole
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Technical Specifications
Microchip MT8870DE technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
18
PCB
18
Package Length (mm)
23.73(Max)
Package Width (mm)
7.11(Max)
Package Height (mm)
4.95(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001AC
Category
DTMF Receiver
Process Technology
CMOS
Operating Frequency
3.58MHz
Max Operating Supply Voltage
5.25V
Min Operating Supply Voltage
4.75V
Typical Supply Current
3mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
5V
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip MT8870DE Datasheet
Download the complete datasheet for Microchip MT8870DE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.