Microchip PM8368-BGI technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 228 |
| PCB | 228 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 60991 |
| ECCN | 5A991.b |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
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